深圳市卓創興電路有限公司是一家致力于高精密單雙面和多層印制電路板、以及金屬基板生產的高新技術企業，公司全體員工300余人，擁有現代化的專業生產設備和檢測設備，嚴格按照現代化企業制度管理規范運作，組建了一批專業從事PCB的生產制造團隊，卓越的品質來自卓越的管理團隊，能為您提供優質快速及個性化的OEM/ODM增值服務。
公司生產的高精密電路板廣泛用于PC、通信、工控、消費電子、航空航天、生物醫療等高科技領域。公司產品質量參照IPC標準，并通過ISO9001品質保證體系，UL安全認證等認證，產品遠銷全國各地以及歐美、日本、東南亞等國家和地區。
作為一家有抱負和強烈社會責任感的企業，公司秉承“致力于成為PCB行業中最優秀增值服務商”的經營理念，并以此理念，我們曾諾持續改善、追求卓越、為共同實現客戶您的產品構想而不懈努力！
Surface treatment：ENIG
Number of layers：4
Board Thickness：0.9mm
Min. Hole Size：0.3mm
Min. trace width/trace space: 0.12/0.12mm
Particularity：Rogers 4835 + FR4
Application：automotive radar
Surface treatment：ENIG
Number of layers：6
Board Thickness：1.15mm
Min. Hole Size：0.25mm
Min. trace width/trace space: 0.1/0.1mm
Particularity：mechanically drilled blind hole, Rogers 4350 + FR4
Application：ADAS
Surface treatment：ENIG
Number of layers：12
Board Thickness：2.1mm
Min. Hole Size：0.3mm
Min. trace width/trace space: 0.2/0.2mm
Particularity：Particularity: resin plug hole, depth control drill
Application：power supply
Surface treatment：ENIG
Number of layers：Number of layers: 3
Board Thickness：2.1mm
Min. Hole Size：0.3mm
Min. trace width/trace space: 0.2/0.2mm
Particularity：copper-inlay
Application：communication
Surface treatment：ENIG
Number of layers：2L
Board Thickness：0.5mm
Min. Hole Size： 0.3mm
Min. trace width/trace space: 0. 2/0. 2mm
Particularity：through-hole filling; aspect ratio 1: 1
Application：LED
Surface treatment：ENIG
Number of layers：6L
Board Thickness：0.8mm
Min. Hole Size：0.3mm
Min. trace width/trace space: 0. 15/0.15mm
Particularity：long and short gold finger + step routing slot
Application：industrial control
Surface treatment：ENIG
Number of layers：4
Board Thickness：1.2mm
Min. Hole Size：0.075mm
Min. trace width/trace space: 0.1/0.1mm
Particularity：2-order HDI, blind hole, buried hole
Application：communication
Surface treatment：ENIG
Number of layers：8L
Board Thickness：1.3mm
Min. Hole Size： 0.1mm
Min. trace width/trace space: 0.1/0.1mm
Particularity：1st order HDI, blind hole, buried hole, rigid-flex
Application：automotive electronics
Surface treatment：ENIG
Number of layers： 4L
Board Thickness：2.1mm
Min. Hole Size：0.3mm
Min. trace width/trace space: 0.2/0.2mm
Particularity：semi-flex
Application：communication
Surface treatment：electrogilding
Layer count：2L
Maximum finished board thickness：0.15±0.03mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.07/0.07mm
Feature：
Application：industrial control
Surface treatment：ENIG
Layer count：2
Maximum finished board thickness：0.15±0.03mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.07/0.07mm
Feature：
Application：medical
Surface treatment：ENIG
Layer count：2
Maximum finished board thickness：0.10±0.03mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.06/0.06mm
Feature：impedance accuracy: 10%
Application：UAV
Surface treatment：Surface treatment: immersion gold
Layer count：4
Maximum finished board thickness：0.2mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.07/0.1mm
Feature：Impedance accuracy ±10%
Application：Application: smartphone (camera)
Surface treatment：ENIG
Layer count：2L
Maximum finished board thickness：0.12 ± 0.03mm
Minimum hole size：0.10mm
Minimum trace width /spacing: 0.06/0.06mm
Feature：
Application：smartphone (fingerprint identification)
Surface treatment：ENIG
Layer count：2
Maximum finished board thickness：0.12±0.03mm
Minimum hole size：0.10mm
Minimum trace width /spacing: 0.06/0.06mm
Feature：
Application：smartphone (fingerprint identification)
Surface treatment：ENIG
Layer count：2
Maximum finished board thickness：0.12±0.03mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.06/0.06mm
Feature：laser spot welding
Application：smartphone (fingerprint identification)
Surface treatment：ENIG
Layer count：2
Maximum finished board thickness：0.11±0.03mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.085/0.09mm
Feature：
Application：smartphone
Surface treatment：ENIG
Layer count：2L
Maximum finished board thickness：0.12±0.03mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.055/0.06mm
Feature：
Application：liquid crystal display module
Surface treatment：ENIG
Layer count：2L
Maximum finished board thickness：0.12±0.03mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.04/0.08mm
Feature：
Application：liquid crystal display module
更多產品
Surface treatment：ENIG
Number of layers： 6L
Board Thickness： 0.79mm
Min. Hole Size： 0.3mm
Min. trace width/trace space: 0.15/0.15mm
Particularity： long and short gold finger + step routing slot
Application：industrial control
Surface treatment：ENIG
Number of layers：4L
Board Thickness：0.6mm
Min. Hole Size：0.12/0.12mm
Min. trace width/trace space: 0. 3mm
Particularity：
Application： industrial control
Surface treatment： ENIG
Number of layers：12L
Board Thickness：1.02mm
Min. Hole Size：0.2mm
Min. trace width/trace space: 0.1/0.1mm
Particularity：Fine lines, micro-vias
Application：industrial control
Surface treatment： immersion gold
Layer count： 2
Maximum finished board thickness：0.13±0.03mm
Minimum hole size：0.20mm
Minimum trace width /spacing: 0.07/0.07mm
Feature：
Application：smartphone
Surface treatment：immersion gold
Layer count：3
Maximum finished board thickness：0.2±0.05mm
Minimum hole size：0.20mm
Minimum trace width /spacing: 0.15/0.078mm
Feature：
Application：smartphone
Surface treatment： immersion gold
Layer count：4
Maximum finished board thickness：0.25±/-0.03mm
Minimum hole size：0.10mm
Minimum trace width /spacing: 0.06/0.06mm
Feature：impedance accuracy: ±10%
Application：smartphone
Surface treatment： immersion gold
Layer count：3
Maximum finished board thickness：0.23±0.05mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.10/0.15mm
Feature：impedance accuracy ±10%
Application：smartphone
Surface treatment：ENIG
Layer count：6L
Maximum finished board thickness：0.5±0.02mm/-0.05 mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.07/0.06mm
Feature：
Application：smartphone
| Layer Count: | 1-32 Layers |
| Min Line width/Line space: | 3 mil/3 mil |
| Min mechanical drilling hole size | Board thickness≦ 1.2mm 0.15mm |
| Board thickness≦ 2.5mm 0.2mm | |
| Board thickness>2.5mm Aspectratio≦ 15:1 | |
| Aspect ratio | 15:1 |
| Finished Board Thickness | Max 10mm |
| Min 2L: 0.2mm; 4L: 0.35mm; 6L: 0.55mm; 8L: 0.8mm; 10L: 1.0mm | |
| Finished copper thickness(inner layer/out layer) | 6oz/10oz |
| Max panel size | 450x1800mm (18"x71") |
| PTH wall thickness | 0.025mm |
| PTH hole dia. tolerance | ±0.075mm |
| Non PTH hole dia. tolerance | ±0.05mm |
| Hole position deviation | ±0.05mm |
| Outline tolerance | ±0.10mm |
| Min S/M Pitch | 0.075mm |
| Twist and Bow | ≤1.0% |
| Test Voltage | 50~300v |
| Electric strength | ＞1.3KV/mm |
| Current breakdown | 10A |
| Peel strength | 1.4N/mm |
| Soldermask abrasion | ＞6H |
| Thermal stress | 288℃ 20Sec |
| Flammability | 94V-0 |
| Impedance Control | +/-5%(Differential) |
| Blind/Buried via | yes |
| Surface Finished | ENIG, ImAg ,ImSn, OSP, Leaded HAL, Lead free HAL(SN100C), Flash Gold,Hard Gold |
| Impedance Tolerance | ± 10% |
| Min dielectric thickness | 2mil |
| Type of dielectric material | FR4, High TG, Halogen Free material, Aluminum basedmatcrial,Copper based material,High frequency material, PTFE material, Heavy copper foil,Paperphenolic plate, BT, PI, Composite material, PTFE+metal based. |
| Major Material supplier | Shengyi 、 ITEQ、 Isola、Ventec、 KB、Rogers、Taconic、Nelco、Bergquist。 |
特色技術 ‐ 盲孔和埋孔，焊盤，硬金和金手指，閃金，鎳/鈀/金表面處理，邊緣電鍍，卡式孔，壓入孔，深度控制布線，埋頭孔。
◆ 完全符合ISO 質量管理體系，通過了ISO9001:2008, ISO14001:2004, ISO/TS16949:2009美國和加拿大UL認證
◆ AOI、孔銅測試、可焊性測試、XRF測試、阻抗控制/測試、金相測試分析
◆ 100% 測試和檢驗，產品符合IPC-A-600-H和IPC-6012標準
◆ 出貨前二次檢驗
我們隨時為您服務
聯系人：劉先生13692188798
Q Q：1078645795
個人郵箱：tc88pcb@126.com
公司網址：http://m.tz-jn.cn
市場部郵箱：pcbzcx@126.com
地址：深圳市寶安區福永街道白石廈東區新開發區12棟
聯系人：17362398668 張先生（微信同號）
公司網址：http://m.tz-jn.cn
市場部郵箱：pcbzcx@126.com
地址：深圳市寶安區福永街道白石廈東區新開發區12棟
